abse/gameboy-advance

This code defines a collection of hardware components, including microcontrollers, sensors, display modules, power management ICs, and passive/passive components, each modeled as 3D symbols with specific footprints, pin configurations, and associated models for PCB and schematic design.

Version
0.0.10
License
unset
Stars
0

artifacts/drc-report-no-pours.json

{
  "input": "dist/index/circuit.json",
  "errorCount": 13,
  "byType": {
    "pcb_via_trace_clearance_error": 1,
    "pcb_pad_pad_clearance_error": 6,
    "pcb_trace_error": 2,
    "pcb_placement_error": 4
  },
  "errors": [
    {
      "type": "pcb_via_trace_clearance_error",
      "message": "Via pcb_via[#pcb_via_153] and trace trace[.U1 > port.pin58, .U2 > port.3] are too close (clearance: 0.054mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "source_trace_35",
        "source_trace_35_0",
        "source_trace_35_0"
      ],
      "signature": "pcb_via_trace_clearance_error|source_trace_35,source_trace_35_0,source_trace_35_0||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_0] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_0"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_0||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_1] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_1"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_1||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_6] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_2"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_2||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_86] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_3"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_3||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_152] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_4"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_4||"
    },
    {
      "type": "pcb_pad_pad_clearance_error",
      "message": "Via pcb_via[#pcb_via_153] and pad pcb_port[.U1 > .GND] are too close (clearance: 0mm, minimum: 0.1mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_pad_pad_clearance_error_5"
      ],
      "signature": "pcb_pad_pad_clearance_error|pcb_pad_pad_clearance_error_5||"
    },
    {
      "type": "pcb_trace_error",
      "message": "Trace [trace[.U1 > port.pin58, .U2 > port.3]] is missing a connection to smtpad[.U2 > .pin3]",
      "locationMm": null,
      "relatedElements": [
        "source_trace_35",
        "source_trace_35",
        "source_trace_35"
      ],
      "signature": "pcb_trace_error|source_trace_35,source_trace_35,source_trace_35||"
    },
    {
      "type": "pcb_trace_error",
      "message": "Trace [trace[.U1 > port.pin59, .U2 > port.2]] is missing a connection to smtpad[.U2 > .pin2]",
      "locationMm": null,
      "relatedElements": [
        "source_trace_34",
        "source_trace_34",
        "source_trace_34"
      ],
      "signature": "pcb_trace_error|source_trace_34,source_trace_34,source_trace_34||"
    },
    {
      "type": "pcb_placement_error",
      "message": "Via copper at (0.26mm, 15.98mm) overlaps SMD pad U1.GND at (0.00mm, 17.00mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_placement_error_0",
        "subcircuit_source_group_4"
      ],
      "signature": "pcb_placement_error|pcb_placement_error_0,subcircuit_source_group_4||"
    },
    {
      "type": "pcb_placement_error",
      "message": "Via copper at (1.43mm, 16.67mm) overlaps SMD pad U1.GND at (0.00mm, 17.00mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_placement_error_1",
        "subcircuit_source_group_4"
      ],
      "signature": "pcb_placement_error|pcb_placement_error_1,subcircuit_source_group_4||"
    },
    {
      "type": "pcb_placement_error",
      "message": "Via copper at (1.51mm, 16.01mm) overlaps SMD pad U1.GND at (0.00mm, 17.00mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_placement_error_2",
        "subcircuit_source_group_4"
      ],
      "signature": "pcb_placement_error|pcb_placement_error_2,subcircuit_source_group_4||"
    },
    {
      "type": "pcb_placement_error",
      "message": "Via copper at (0.09mm, 15.28mm) overlaps SMD pad U1.GND at (0.00mm, 17.00mm)",
      "locationMm": null,
      "relatedElements": [
        "pcb_placement_error_3",
        "subcircuit_source_group_4"
      ],
      "signature": "pcb_placement_error|pcb_placement_error_3,subcircuit_source_group_4||"
    }
  ],
  "attribution": {
    "note": "A record identifies the DRC type, location when emitted, and related PCB/source elements. To determine whether it was introduced by a change, compare these stable signatures against an equivalent baseline routing run using the same router version and board input."
  }
}